Invention Grant
- Patent Title: Methods of forming microvias with reduced diameter
-
Application No.: US17006277Application Date: 2020-08-28
-
Publication No.: US11315890B2Publication Date: 2022-04-26
- Inventor: Chintan Buch , Roman Gouk , Steven Verhaverbeke
- Applicant: Applied Materials, Inc.
- Applicant Address: US CA Santa Clara
- Assignee: Applied Materials, Inc.
- Current Assignee: Applied Materials, Inc.
- Current Assignee Address: US CA Santa Clara
- Agency: Servilla Whitney LLC
- Main IPC: H01L23/00
- IPC: H01L23/00
Abstract:
A method for forming microvias for packaging applications is disclosed. A sacrificial photosensitive material is developed to form microvias with reduced diameter and improved placement accuracy. The microvias are filled with a conductive material and the surrounding dielectric is removed and replaced with an RDL polymer layer.
Information query
IPC分类:
