A semiconductor arrangement includes at least two switching devices of a first type electrically coupled in parallel between a first terminal and a second terminal, and at least two switching devices of a second type electrically coupled in parallel between the second terminal and a third terminal. The switching devices of the first type and the switching devices of the second type are arranged in a power semiconductor module that has first and second longitudinal sides and first and second narrow sides. The switching devices of the first type and the switching devices of the second type are arranged next to each other in at least one row extending in a first horizontal direction that is parallel to the first and second longitudinal sides, such that within each of the at least one rows no more than two switching devices of the same type are arranged in direct succession.