Camera module, photosensitive component, photosensitive-component joined panel, and forming die thereof and manufacturing method thereof

Invention Grant

US11315967B2 Camera module, photosensitive component, photosensitive-component joined panel, and forming die thereof and manufacturing method thereof 有权

Patent Title: Camera module, photosensitive component, photosensitive-component joined panel, and forming die thereof and manufacturing method thereof
Application No.: US16651455

Application Date: 2018-09-19
Publication No.: US11315967B2

Publication Date: 2022-04-26
Inventor: Takehiko Tanaka , Bojie Zhao , Zhewen Mei , Nan Guo
Applicant: NINGBO SUNNY OPOTECH CO., LTD.
Applicant Address: CN Zhejiang
Assignee: NINGBO SUNNY OPOTECH CO., LTD.
Current Assignee: NINGBO SUNNY OPOTECH CO., LTD.
Current Assignee Address: CN Zhejiang
Agency: Wenderoth, Lind & Ponack, L.L.P.
Priority: CN201710895910.4 20170928,CN201721262500.8 20170928
International Application: PCT/CN2018/106351 WO 20180919
International Announcement: WO2019/062609 WO 20190404
Main IPC: H01L27/146
IPC: H01L27/146 ; H04N5/225

Abstract:

Provided is a camera module and a photosensitive component thereof and a manufacturing method thereof.

Public/Granted literature

Information query

Espacenet

IPC分类:

H	电学
H01	基本电气元件
H01L	半导体器件；其他类目中不包括的电固体器件（使用半导体器件的测量入G01；一般电阻器入H01C；磁体、电感器、变压器入H01F；一般电容器入H01G；电解型器件入H01G9/00；电池组、蓄电池入H01M；波导管、谐振器或波导型线路入H01P；线路连接器、汇流器入H01R；受激发射器件入H01S；机电谐振器入H03H；扬声器、送话器、留声机拾音器或类似的声机电传感器入H04R；一般电光源入H05B；印刷电路、混合电路、电设备的外壳或结构零部件、电气元件的组件的制造入H05K；在具有特殊应用的电路中使用的半导体器件见应用相关的小类）
H01L27/00	由在一个共用衬底内或其上形成的多个半导体或其他固态组件组成的器件（其零部件入H01L23/00，H01L29/00至H01L51/00；由多个单个固态器件组成的组装件入H01L25/00）
H01L27/14	.包括有对红外辐射、光、较短波长的电磁辐射或者微粒子辐射并且专门适用于把这样的辐射能转换为电能的，或适用于通过这样的辐射控制电能的半导体组件的（只与一个或多个电光源在结构上相结合的辐射敏感元件入H01L31/14；光导与光电元件的耦合入G02B6/42）
H01L27/144	..由辐射控制的器件
H01L27/146	...图像结构