Invention Grant
- Patent Title: Method for manufacturing semiconductor device
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Application No.: US16937321Application Date: 2020-07-23
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Publication No.: US11316039B2Publication Date: 2022-04-26
- Inventor: Chao-Hsin Wu , Li-Cheng Chang , Cheng-Jia Dai , Shun-Cheng Yang
- Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD. , NATIONAL TAIWAN UNIVERSITY
- Applicant Address: TW Hsinchu; TW Taipei
- Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.,NATIONAL TAIWAN UNIVERSITY
- Current Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.,NATIONAL TAIWAN UNIVERSITY
- Current Assignee Address: TW Hsinchu; TW Taipei
- Agency: Maschoff Brennan
- Main IPC: H01L29/778
- IPC: H01L29/778 ; H01L29/205 ; H01L29/66 ; H01L29/207 ; H01L29/10 ; H01L29/78

Abstract:
A method of manufacturing a semiconductor device is provided. The method includes forming a channel layer and an active layer over a substrate; forming a doped epitaxial layer over the active layer; patterning the doped epitaxial layer, the active layer, and the channel layer to form a fin structure comprising a doped epitaxial fin portion, an active fin portion below the doped epitaxial fin portion, and a channel fin portion below the active fin portion; removing the doped epitaxial fin portion; and forming a gate electrode at least partially extending along a sidewall of the fin structure to form a Schottky barrier between the gate electrode and the fin structure after removing the doped epitaxial fin portion.
Information query
IPC分类: