Invention Grant
- Patent Title: High electron mobility transistor
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Application No.: US17020800Application Date: 2020-09-14
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Publication No.: US11316040B2Publication Date: 2022-04-26
- Inventor: Franky Juanda Lumbantoruan , Chia-Ching Huang , Chih-Yen Chen
- Applicant: Vanguard International Semiconductor Corporation
- Applicant Address: TW Hsinchu
- Assignee: Vanguard International Semiconductor Corporation
- Current Assignee: Vanguard International Semiconductor Corporation
- Current Assignee Address: TW Hsinchu
- Agent Winston Hsu
- Main IPC: H01L29/778
- IPC: H01L29/778

Abstract:
A high electron mobility transistor includes a channel layer, a barrier layer, a first compound semiconductor layer, and a second compound semiconductor layer. The channel layer is disposed on the substrate, and the barrier layer is disposed on the channel layer. The first compound semiconductor layer is disposed on the barrier layer. The second compound semiconductor layer is disposed between the barrier layer and the first compound semiconductor layer, where the first compound semiconductor layer and the second compound semiconductor layer include a concentration distribution of metal dopant, and the concentration distribution of metal dopant includes a first peak in the first compound semiconductor layer and a second peak in the second compound semiconductor layer.
Public/Granted literature
- US20220085196A1 HIGH ELECTRON MOBILITY TRANSISTOR Public/Granted day:2022-03-17
Information query
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