Invention Grant
- Patent Title: Light-emitting module and method for manufacturing same
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Application No.: US17006760Application Date: 2020-08-28
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Publication No.: US11316081B2Publication Date: 2022-04-26
- Inventor: Yoshikazu Matsuda
- Applicant: NICHIA CORPORATION
- Applicant Address: JP Anan
- Assignee: NICHIA CORPORATION
- Current Assignee: NICHIA CORPORATION
- Current Assignee Address: JP Anan
- Agency: Hunton Andrews Kurth LLP
- Priority: JPJP2019-158717 20190830
- Main IPC: H01L33/50
- IPC: H01L33/50 ; H01L33/62

Abstract:
A light-emitting module includes an optical member including a first major surface, and a second major surface; a light-emitting device bonded to the first major surface, the light-emitting device including a light-emitting element including a major light-emitting surface, an electrode surface, and an electrode disposed at the electrode surface, a resin member covering a side surface of the light-emitting element, and a conductive layer disposed continuously on the electrode and on the resin member; an insulating member covering the first major surface of the optical member, a side surface of the light-emitting device, and a portion of the conductive layer of the light-emitting device; and a wiring member disposed on the insulating member and electrically connected to the conductive layer.
Public/Granted literature
- US20210066553A1 LIGHT- EMITTING MODULE AND METHOD FOR MANUFACTURING SAME Public/Granted day:2021-03-04
Information query
IPC分类: