The present disclosure provides a semiconductor device package. The semiconductor device package includes a first substrate having a first surface and a second surface opposite to the first surface, an antenna module disposed on the first surface of the first substrate, an electronic component module disposed on the first surface of the first substrate, and a first package body encapsulating the antenna module and the electronic component module. The antenna module has a first surface facing the first surface of the first substrate, a second surface opposite to the first surface of the antenna module, and a lateral surface extending between the first surface of the antenna module and the second surface of the antenna module. The lateral surface of the antenna module faces the electronic component module. A method of manufacturing a semiconductor device package is also provided.