The present disclosure provides an antenna packaging structure and a method for forming the same. The structure includes: a supporting substrate, a rewiring layer on the supporting substrate, a first antenna layer disposed on the rewiring layer, first metal feedline pillars disposed on the first antenna layer, a first packaging layer covering the first metal feedline pillars except exposing the top surfaces of the first metal feedline pillars; a second antenna layer on the first packaging layer, second metal feedline pillars, a second packaging layer covering the second metal feedline pillars except exposing the top surfaces of the second metal feedline pillars; a third antenna layer disposed on the second packaging layer, semiconductor chips connected to the rewiring layer, a metal bump disposed inside an opening in the rewiring layer, and a third packaging layer encapsulating the semiconductor chips and the metal bump.