Invention Grant
- Patent Title: High frequency circuit and communication device
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Application No.: US16858013Application Date: 2020-04-24
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Publication No.: US11316486B2Publication Date: 2022-04-26
- Inventor: Kazuaki Deguchi
- Applicant: Murata Manufacturing Co., Ltd.
- Applicant Address: JP Kyoto
- Assignee: Murata Manufacturing Co., Ltd.
- Current Assignee: Murata Manufacturing Co., Ltd.
- Current Assignee Address: JP Kyoto
- Agency: Pearne & Gordon LLP
- Priority: JPJP2019-085021 20190426
- Main IPC: H03F3/191
- IPC: H03F3/191 ; H03F3/24 ; H03F3/195 ; H03F3/21 ; H03F1/56 ; H04B1/04

Abstract:
A high frequency circuit includes a transmit terminal and a transmit and receive terminal, a power amplifier that amplifies a high frequency signal inputted from the transmit terminal and outputs the high frequency signal toward the transmit and receive terminal, and an output matching circuit that is positioned on a signal path connecting the power amplifier and the transmit and receive terminal and that optimizes the output load impedance of the power amplifier. The output matching circuit includes a matching circuit coupled to an output terminal of the power amplifier, another matching circuit, and a switch that changes a connection between the matching circuits. The power amplifier and the switch are formed at a single semiconductor IC. The matching circuits are formed outside the semiconductor IC.
Public/Granted literature
- US20200343866A1 HIGH FREQUENCY CIRCUIT AND COMMUNICATION DEVICE Public/Granted day:2020-10-29
Information query
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