Invention Grant
- Patent Title: Optical module
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Application No.: US17113414Application Date: 2020-12-07
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Publication No.: US11317513B2Publication Date: 2022-04-26
- Inventor: Daisuke Noguchi , Hiroshi Yamamoto
- Applicant: CIG Photonics Japan Limited
- Applicant Address: JP Kanagawa
- Assignee: CIG Photonics Japan Limited
- Current Assignee: CIG Photonics Japan Limited
- Current Assignee Address: JP Kanagawa
- Agency: Mattingly & Malur, PC
- Priority: JPJP2019-230383 20191220
- Main IPC: H05K7/00
- IPC: H05K7/00 ; H05K1/14 ; H05K1/11 ; H05K1/18 ; H05K3/28

Abstract:
An optical module includes a photoelectric device and a flexible printed circuit board. The flexible printed circuit board includes an insulating substrate with a first surface and a second surface, a first wiring pattern on the first surface, and a second wiring pattern on the second surface. The first wiring pattern includes a signal line with a signal terminal portion at a tip and a signal-line portion narrower than the signal terminal portion, the first wiring pattern including a pair of ground pads at positions sandwiching the signal-line portion, at least part of the pair of ground pads avoiding being adjacent to the signal terminal portion. The second wiring pattern includes a ground plane overlapping with the signal-line portion and being connected to the pair of ground pads, the second wiring pattern including a signal pad connected to the signal terminal portion.
Public/Granted literature
- US20210195746A1 OPTICAL MODULE Public/Granted day:2021-06-24
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