Invention Grant
- Patent Title: Buckle assembly and electronic device using the same
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Application No.: US17185346Application Date: 2021-02-25
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Publication No.: US11317523B2Publication Date: 2022-04-26
- Inventor: Chen-Yun Hsieh , Wei-Lung Lin , Geng-Siang Hu
- Applicant: PEGATRON CORPORATION
- Applicant Address: TW Taipei
- Assignee: PEGATRON CORPORATION
- Current Assignee: PEGATRON CORPORATION
- Current Assignee Address: TW Taipei
- Agency: J.C. Patents
- Priority: TW109107512 20200306
- Main IPC: H05K5/00
- IPC: H05K5/00 ; F16B35/04

Abstract:
A buckle assembly and an electronic device using the same are provided. The buckle assembly is adapted to be assembled on a housing of the electronic device. The housing has an inner surface and a first hole. The buckle assembly includes an assembly element, a slider, and an abutting member. The assembly element is assembled in the first hole along a first direction; the slider is disposed on the inner surface of the housing and is capable of moving relative to the housing along a second direction to lock or unlock the assembly element, wherein the second direction is perpendicular to the first direction; and the abutting member is disposed on the inner surface of the housing and is used to abut against the slider when the slider locks the assembly element.
Public/Granted literature
- US20210282278A1 BUCKLE ASSEMBLY AND ELECTRONIC DEVICE USING THE SAME Public/Granted day:2021-09-09
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