Invention Grant
- Patent Title: Technologies for improving processor thermal design power
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Application No.: US15859392Application Date: 2017-12-30
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Publication No.: US11317542B2Publication Date: 2022-04-26
- Inventor: Blaine Monson , Pankaj Kumar , Steven Miller
- Applicant: Intel Corporation
- Applicant Address: US CA Santa Clara
- Assignee: Intel Corporation
- Current Assignee: Intel Corporation
- Current Assignee Address: US CA Santa Clara
- Agency: Compass IP Law PC
- Main IPC: H05K7/20
- IPC: H05K7/20 ; H05K7/14

Abstract:
A compute device for operation in a rack of a data center includes a substrate, a solid state drive array, a fan array, and a plurality of physical resources. The components of the compute device are arranged on the substrate to prevent or reduce shadowing of heat-producing physical resources, such as a processor, by other heat-producing physical resources relative to an airflow generated by the fan array. To do so, ruler solid state drives are used to facilitate positioning of the fan array toward a front edge of the substrate.
Public/Granted literature
- US20190045668A1 TECHNOLOGIES FOR IMPROVING PROCESSOR THERMAL DESIGN POWER Public/Granted day:2019-02-07
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