Invention Grant
- Patent Title: Ultrasonic endoscope and method for manufacturing same
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Application No.: US16235439Application Date: 2018-12-28
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Publication No.: US11317897B2Publication Date: 2022-05-03
- Inventor: Satoru Okada , Katsuya Yamamoto , Yasuhiko Morimoto
- Applicant: FUJIFILM Corporation
- Applicant Address: JP Tokyo
- Assignee: FUJIFILM Corporation
- Current Assignee: FUJIFILM Corporation
- Current Assignee Address: JP Tokyo
- Agency: Birch, Stewart, Kolasch & Birch, LLP
- Priority: JPJP2016-130194 20160630
- Main IPC: A61B8/00
- IPC: A61B8/00 ; A61B8/12 ; A61B1/00 ; A61B1/12 ; B06B1/06 ; H01L41/04 ; H01L41/047 ; H01L41/29 ; H01R9/05 ; H01R4/02

Abstract:
The invention has, at a distal end part thereof, an ultrasonic oscillator array in which a plurality of ultrasonic oscillators are arranged; a shielded cable including a plurality of signal lines, and a plurality of metallic shield members disposed outside the signal lines; a wiring part including a plurality of connecting parts that electrically connect the plurality of signal lines to the plurality of ultrasonic oscillators, respectively; a ground part that is electrically connected to the plurality of shield members and has heat conductivity; a sheet-like first heat-conduction member disposed on a side surface of the ultrasonic oscillator array; and a second heat-conduction member that thermally connects the first heat-conduction member to the ground part. Accordingly, an ultrasonic endoscope capable of improving diagnostic accuracy in ultrasonic diagnosis, and a method for manufacturing the ultrasonic endoscope are provided.
Public/Granted literature
- US20190133559A1 ULTRASONIC ENDOSCOPE AND METHOD FOR MANUFACTURING SAME Public/Granted day:2019-05-09
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