Invention Grant
- Patent Title: Substrate processing device and substrate processing method
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Application No.: US17273123Application Date: 2019-07-18
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Publication No.: US11318504B2Publication Date: 2022-05-03
- Inventor: Kenji Kawaguchi , Toru Endo , Kota Tanikawa
- Applicant: SCREEN Holdings Co., Ltd.
- Applicant Address: JP Kyoto
- Assignee: SCREEN Holdings Co., Ltd.
- Current Assignee: SCREEN Holdings Co., Ltd.
- Current Assignee Address: JP Kyoto
- Agency: Ostrolenk Faber LLP
- Priority: JPJP2018-176394 20180920
- International Application: PCT/JP2019/028345 WO 20190718
- International Announcement: WO2020/059280 WO 20200326
- Main IPC: H01L21/67
- IPC: H01L21/67 ; B08B3/08

Abstract:
The substrate processing apparatus includes: a nozzle having a spout and adapted to spout SPM from the spout toward a substrate; a mixing portion communicating with the spout; a sulfuric acid-containing liquid supply device which recovers liquid supplied to and expelled from the substrate held by a substrate holding unit, prepares a sulfuric acid-containing liquid from the recovered liquid, and supplies the prepared sulfuric acid-containing liquid to the mixing portion; and a control device. The control device performs: a sulfuric acid-containing liquid preparing step of recovering SPM supplied to and expelled from the substrate and preparing the sulfuric acid-containing liquid; and an SPM spouting step of supplying the prepared sulfuric acid-containing liquid and hydrogen peroxide water to the mixing portion, mixing the sulfuric acid-containing liquid and hydrogen peroxide water together in the mixing portion to prepare SPM, and spouting the prepared SPM from the spout.
Public/Granted literature
- US20210252560A1 SUBSTRATE PROCESSING DEVICE AND SUBSTRATE PROCESSING METHOD Public/Granted day:2021-08-19
Information query
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