- Patent Title: Machining condition adjustment device and machine learning device
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Application No.: US16541157Application Date: 2019-08-15
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Publication No.: US11318565B2Publication Date: 2022-05-03
- Inventor: Takashi Izumi
- Applicant: FANUC Corporation
- Applicant Address: JP Yamanashi
- Assignee: FANUC Corporation
- Current Assignee: FANUC Corporation
- Current Assignee Address: JP Yamanashi
- Agency: Hauptman Ham, LLP
- Priority: JPJP2018-157523 20180824
- Main IPC: B23K31/00
- IPC: B23K31/00 ; B23K26/14 ; B23K26/70 ; G06N3/08

Abstract:
A machining condition adjustment device adjusts settings of an ionizer so as to neutralize a charge carried by plasma generated during laser beam machining of a workpiece by a laser beam machining device, calculates an amount of charge per unit time that is to be radiated from the ionizer, based on the amount of charge carried by the plasma generated during the laser beam machining, and sets the ionizer to radiate the calculated amount of charge per unit time.
Public/Granted literature
- US20200061755A1 MACHINING CONDITION ADJUSTMENT DEVICE AND MACHINE LEARNING DEVICE Public/Granted day:2020-02-27
Information query
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