Invention Grant
- Patent Title: Forming-material connecting device and forming apparatus
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Application No.: US17011704Application Date: 2020-09-03
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Publication No.: US11318638B2Publication Date: 2022-05-03
- Inventor: Taichi Yamada , Wataru Suzuki
- Applicant: FUJIFILM BUSINESS INNOVATION CORP.
- Applicant Address: JP Tokyo
- Assignee: FUJIFILM BUSINESS INNOVATION CORP.
- Current Assignee: FUJIFILM BUSINESS INNOVATION CORP.
- Current Assignee Address: JP Tokyo
- Agency: Oliff PLC
- Priority: JPJP2020-055094 20200325
- Main IPC: B29B11/00
- IPC: B29B11/00 ; B29B13/00 ; B29B15/00 ; B29B15/08 ; B29B11/16 ; B29B11/12 ; B29C70/20 ; B29B13/02 ; B29K307/04 ; B29K77/00

Abstract:
A forming-material connecting device includes a cutter that cuts a forming material constituted by plural continuous fiber bundles being impregnated with a resin material and supplied in a supply direction corresponding to an extending direction of the plural continuous fiber bundles. The cutter cuts at least a portion of the plural continuous fiber bundles. The forming-material connecting device also includes a joining portion joining portions of the forming material, which are cut by the cutter at a cutting point in the forming material, on a downstream and upstream side with respect to the cutting point in the supply direction by heating to join the resin materials of the portions of the forming material, or the joining portion joins a preceding forming material's trailing end portion and a leading end portion of a following forming material by heating to join resin materials of the preceding forming material and following forming material.
Public/Granted literature
- US20210299913A1 FORMING-MATERIAL CONNECTING DEVICE AND FORMING APPARATUS Public/Granted day:2021-09-30
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