In a temperature control device, a resin flow channel is formed from a nozzle section and a cylinder section that is connected to the nozzle section and the device controls the temperature of the resin that flows in the resin flow channel. The temperature control device is provided with: a first temperature sensor for detecting the nozzle temperature of the resin flowing through the nozzle section; a first temperature control unit for performing PID control so that the nozzle temperature achieves a first target temperature; multiple second temperature sensors for detecting the cylinder temperature of the resin flowing through the cylinder section; and second temperature control units for performing PID control so that the cylinder temperature achieves a second target temperature. The second temperature control units perform PID control of the cylinder temperature using temperature control information from the first temperature control unit.