A machine arrangement, for sequentially processing sheet-type substrates, includes a plurality of different processing stations, one of which includes a non-impact printing device that prints the substrates. The processing station, including the non-impact printing device, also includes a printing cylinder, on the circumference of which, the non-impact printing device that prints the substrates is arranged. On the circumferential surface of the printing cylinder, four substrates are or can be placed behind each other in the circumferential direction. Each of the substrates that are to be conveyed are retained in one of a force-locking and a form-fitting manner on the circumferential surface of the printing cylinder by at least one retaining element.