Invention Grant
- Patent Title: Logic circuitry package
-
Application No.: US16769922Application Date: 2019-10-25
-
Publication No.: US11318752B2Publication Date: 2022-05-03
- Inventor: James Michael Gardner , Scott A. Linn
- Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.
- Applicant Address: US TX Spring
- Assignee: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.
- Current Assignee: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.
- Current Assignee Address: US TX Spring
- Agency: Dicke Billig & Czaja PLLC
- International Application: PCT/US2019/058004 WO 20191025
- International Announcement: WO2021/080596 WO 20210429
- Main IPC: B41J2/175
- IPC: B41J2/175 ; B41J2/045 ; G05B19/042 ; G05B19/00

Abstract:
A logic circuitry package for a replaceable print apparatus component includes an analog sensor cell block with a plurality of sensor cells, analog control circuitry to bias and control the analog sensor cell block, an interface to communicate with a print apparatus logic circuit, a dedicated bit field that indicates whether the logic circuitry package is in a power saving mode, and at least one logic circuit. The at least one logic circuit may be configured to receive, via the interface, a request to cause the analog sensor cell block to provide sensor information for at least one sensor measurement; and selectively enable and disable power to the analog control circuitry based on the request and a value of the dedicated bit field.
Public/Granted literature
- US20220001672A1 LOGIC CIRCUITRY PACKAGE Public/Granted day:2022-01-06
Information query
IPC分类: