Invention Grant
- Patent Title: Radiation-sensitive resin composition, production method thereof, and resist pattern-forming method
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Application No.: US17013716Application Date: 2020-09-07
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Publication No.: US11319388B2Publication Date: 2022-05-03
- Inventor: Ken Maruyama , Yoshiki Nonoyama , Takuo Sone , Motohiro Shiratani
- Applicant: JSR CORPORATION
- Applicant Address: JP Tokyo
- Assignee: JSR CORPORATION
- Current Assignee: JSR CORPORATION
- Current Assignee Address: JP Tokyo
- Agency: Element IP, PLC
- Priority: JPJP2018-041960 20180308
- Main IPC: C08F2/46
- IPC: C08F2/46 ; C08F2/50 ; C08G61/04 ; C08F220/18 ; C08K5/357 ; C08K5/375 ; C08L33/10 ; G03F7/038

Abstract:
A radiation-sensitive resin composition contains: a polymer having a first structural unit represented by formula (1), and a second structural unit represented by formula (2) and having an acid-labile group. A first acid, to be generated from the first acid generating agent, disassociates the acid labile group in the polymer upon heating under a condition involving a temperature of no less than 80° C. and no greater than 140° C. for a time period of 1 minute, and the second acid, to be generated from the second acid generating agent, does not substantially disassociate the acid-labile group under the condition. The polymer is synthesized by RAFT, ATRP, or NMP, and a RAFT agent is at least one selected from the group consisting of a mercaptocarboxylic acid ester, a disulfide, a dithioester, a xanthate, a dithiocarbamate, and a trithiocarbonate.
Information query