Invention Grant
- Patent Title: Curing agent for water-based epoxy resin, water-based epoxy resin composition, and cured product thereof
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Application No.: US16343325Application Date: 2017-10-26
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Publication No.: US11319405B2Publication Date: 2022-05-03
- Inventor: Yuiga Asai , Takuma Hanaoka
- Applicant: MITSUBISHI GAS CHEMICAL COMPANY, INC.
- Applicant Address: JP Tokyo
- Assignee: MITSUBISHI GAS CHEMICAL COMPANY, INC.
- Current Assignee: MITSUBISHI GAS CHEMICAL COMPANY, INC.
- Current Assignee Address: JP Tokyo
- Agency: Greenblum & Bernstein, P.L.C.
- Priority: JPJP2016-228364 20161124
- International Application: PCT/JP2017/038651 WO 20171026
- International Announcement: WO2018/096868 WO 20180531
- Main IPC: C08G59/50
- IPC: C08G59/50 ; C07C211/27
Abstract:
A curing agent for a water-based epoxy resin, including a reaction composition (A) containing a reaction product of styrene and an amine compound represented by the following formula (1), a water-based epoxy resin composition containing the same, and a cured product thereof. H2N—CH2-A-CH2—NH2 (1) wherein A is a 1,2-phenylene group, a 1,3-phenylene group, or a 1,4-phenylene group.
Public/Granted literature
- US20190256645A1 CURING AGENT FOR WATER-BASED EPOXY RESIN, WATER-BASED EPOXY RESIN COMPOSITION, AND CURED PRODUCT THEREOF Public/Granted day:2019-08-22
Information query
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