Invention Grant
- Patent Title: Heat treatment apparatus and heat treatment method
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Application No.: US16021890Application Date: 2018-06-28
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Publication No.: US11319605B2Publication Date: 2022-05-03
- Inventor: Wataru Yoshida , Towako Matsui , Katsuhiko Kizawa , Takashi Sada , Tsuyoshi Mikami
- Applicant: JTEKT CORPORATION
- Applicant Address: JP Osaka
- Assignee: JTEKT CORPORATION
- Current Assignee: JTEKT CORPORATION
- Current Assignee Address: JP Osaka
- Agency: Oliff PLC
- Priority: JP2014-212848 20141017
- Main IPC: C21D1/667
- IPC: C21D1/667 ; C21D1/42 ; C21D6/00 ; C22C38/44 ; C22C38/04 ; C22C38/02 ; C22C38/00 ; H05B6/10
Abstract:
A heat treatment apparatus that thermally treats an annular workpiece formed of a steel material by inductively heating the workpiece includes a treatment tank in which the workpiece is set and thermally treated, a holding portion that holds the workpiece at a predetermined position, an induction heating coil that surrounds the workpiece to inductively heat the workpiece, and a cooling medium that cools surfaces of the workpiece during the induction heating of the workpiece.
Public/Granted literature
- US20180305779A1 HEAT TREATMENT APPARATUS AND HEAT TREATMENT METHOD Public/Granted day:2018-10-25
Information query
