- Patent Title: Copper alloy for electronic and electrical equipment, copper alloy plate strip for electronic and electrical equipment, component for electronic and electrical equipment, terminal, busbar, and movable piece for relay
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Application No.: US16076257Application Date: 2017-03-29
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Publication No.: US11319615B2Publication Date: 2022-05-03
- Inventor: Hirotaka Matsunaga , Kazunari Maki
- Applicant: MITSUBISHI MATERIALS CORPORATION
- Applicant Address: JP Tokyo
- Assignee: MITSUBISHI MATERIALS CORPORATION
- Current Assignee: MITSUBISHI MATERIALS CORPORATION
- Current Assignee Address: JP Tokyo
- Agency: Leason Ellis LLP
- Priority: JP2016-069079 20160330,JPJP2017-063258 20170328
- International Application: PCT/JP2017/012993 WO 20170329
- International Announcement: WO2017/170733 WO 20171005
- Main IPC: C22C9/00
- IPC: C22C9/00 ; C21D9/46 ; H01R13/03 ; H01B1/02 ; H01B5/02
Abstract:
A copper alloy for electronic and electrical equipment is provided, including: 0.15 mass % or greater and less than 0.35 mass % of Mg; 0.0005 mass % or greater and less than 0.01 mass % of P; and a remainder which is formed of Cu and unavoidable impurities, in which a conductivity is greater than 75% IACS, a content [Mg] (mass %) of Mg and a content [P] (mass %) of P satisfy a relational expression of [Mg]+20×[P]
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