Invention Grant
- Patent Title: Heat pump cycle
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Application No.: US16843532Application Date: 2020-04-08
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Publication No.: US11320170B2Publication Date: 2022-05-03
- Inventor: Tetsuo Kozasa
- Applicant: DENSO CORPORATION
- Applicant Address: JP Kariya
- Assignee: DENSO CORPORATION
- Current Assignee: DENSO CORPORATION
- Current Assignee Address: JP Kariya
- Agency: Harness, Dickey & Pierce, P.L.C.
- Priority: JPJP2017-200416 20171016
- Main IPC: F24F12/00
- IPC: F24F12/00 ; F24F11/86 ; F25B30/02

Abstract:
A heat pump cycle includes a compressor, a heat exchanger, a gas-liquid separator, and an outdoor heat exchanger. The heat pump cycle includes a main circuit connecting the compressor, the heat exchanger, the gas-liquid separator, and the outdoor heat exchanger such that refrigerant flows therethrough. The heat pump cycle includes an exhaust-heat recovery heat exchanger, and an exhaust-heat recovery circuit forming a flow path leading to the compressor not through the outdoor heat exchanger but through the exhaust-heat recovery heat exchanger. The heat pump cycle includes an expansion valve that is disposed upstream of the exhaust-heat recovery heat exchanger in the exhaust-heat recovery circuit and expands the refrigerant such that the refrigerant changes from liquid phase to gas phase in the exhaust-heat recovery heat exchanger.
Public/Granted literature
- US20200232673A1 HEAT PUMP CYCLE Public/Granted day:2020-07-23
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