Invention Grant
- Patent Title: Loop heat pipe where porous body is in contact with pipe wall of liquid pipe
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Application No.: US16502370Application Date: 2019-07-03
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Publication No.: US11320210B2Publication Date: 2022-05-03
- Inventor: Yoshihiro Machida
- Applicant: SHINKO ELECTRIC INDUSTRIES CO., LTD.
- Applicant Address: JP Nagano
- Assignee: SHINKO ELECTRIC INDUSTRIES CO., LTD.
- Current Assignee: SHINKO ELECTRIC INDUSTRIES CO., LTD.
- Current Assignee Address: JP Nagano
- Agency: Rankin, Hill & Clark LLP
- Main IPC: F28D15/02
- IPC: F28D15/02 ; F28D15/04 ; F28D21/00

Abstract:
A loop heat pipe includes: an evaporator configured to evaporate working fluid; a condenser configured to condense the working fluid; a liquid pipe which connects the evaporator and the condenser and has a first pipe wall and a second pipe wall which is opposed to the first pipe wall; a porous body which is provided in the liquid pipe and is configured to guide the working fluid condensed by the condenser to the evaporator; a flow channel which is a space that is formed in the liquid pipe and guides the working fluid condensed by the condenser to the evaporator; and a vapor pipe which connects the evaporator and the condenser and forms a loop together with the liquid pipe. The porous body is disposed to be in contact with the first pipe wall.
Public/Granted literature
- US20200018556A1 LOOP HEAT PIPE Public/Granted day:2020-01-16
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