A heat dissipation device, includes a vapor chamber including a heat conduction chamber and a first wick structure, the heat conduction chamber having a recessed portion, and the first wick structure disposed in the heat conduction chamber; and a heat pipe including a pipe body and a second wick structure disposed in the pipe body, the pipe body positioned in the recessed portion of the heat conduction chamber. The first wick structure and the second wick structure are metallically bonded.