Invention Grant
- Patent Title: Attachment structure of temperature sensor
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Application No.: US16519712Application Date: 2019-07-23
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Publication No.: US11320317B2Publication Date: 2022-05-03
- Inventor: Hiraku Tanaka
- Applicant: Yazaki Corporation
- Applicant Address: JP Tokyo
- Assignee: Yazaki Corporation
- Current Assignee: Yazaki Corporation
- Current Assignee Address: JP Tokyo
- Agency: Sughrue Mion, PLLC
- Priority: JPJP2018-138379 20180724
- Main IPC: G01K1/00
- IPC: G01K1/00 ; G01K1/14 ; H01M10/48 ; H01M50/20 ; H01M50/502 ; H01M50/543

Abstract:
An attachment structure of temperature sensor includes: a temperature sensor for attached to a single battery and detecting a temperature of the single battery; a temperature measuring element provided in the temperature sensor and detecting the temperature of the single battery; a sensor body provided in the temperature sensor and integrally formed with the temperature measuring element; a housing holding case provided with the single battery, having a engagement part engageable with the temperature sensor, the housing holding case for housing the temperature sensor; an elastic part having an arm shape, projected from the sensor body, and engageable with the engagement part; and a flat part provided in the elastic part, and pressing a pressing surface of an attachment tool against the elastic part when the temperature sensor is housed in the housing holding case.
Public/Granted literature
- US20200033196A1 ATTACHMENT STRUCTURE OF TEMPERATURE SENSOR Public/Granted day:2020-01-30
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