Invention Grant
- Patent Title: Radiation-sensitive resin composition, resist pattern-forming method, acid diffusion control agent, carboxylic acid salt and carboxylic acid
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Application No.: US16552339Application Date: 2019-08-27
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Publication No.: US11320735B2Publication Date: 2022-05-03
- Inventor: Katsuaki Nishikori , Satoshi Okazaki
- Applicant: JSR CORPORATION
- Applicant Address: JP Tokyo
- Assignee: JSR CORPORATION
- Current Assignee: JSR CORPORATION
- Current Assignee Address: JP Tokyo
- Agency: Oblon, McClelland, Maier & Neustadt, L.L.P.
- Priority: JPJP2017-038807 20170301
- Main IPC: G03F7/004
- IPC: G03F7/004 ; C07C59/105 ; C07C59/11 ; C07C59/115 ; C07C59/13 ; C07C69/14 ; C07C381/12 ; C07D307/00 ; C07D307/33 ; G03F7/038 ; G03F7/039 ; G03F7/16 ; G03F7/20 ; G03F7/32 ; G03F7/38

Abstract:
A radiation-sensitive resin composition contains: a polymer having an acid-labile group, a radiation-sensitive acid generator, a compound represented by the following formula (1), and a solvent. In the formula (1), X represents an oxygen atom or a sulfur atom; R1 represents a hydrogen atom or a monovalent organic group having 1 to 20 carbon atoms; R2 to R5 each independently represent a hydrogen atom or a monovalent organic group having 1 to 20 carbon atoms, and optionally two or more of R2 to R5 taken together represent an alicyclic structure having 3 to 20 ring atoms or an aliphatic heterocyclic structure having 3 to 20 ring atoms together with the carbon atom to which the two or more of R2 to R5 bond; Zn+ represents a cation having a valency of n; and n is an integer of 1 to 3.
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