Methods and apparatus to provide power management for multi-die stacks using artificial intelligence are disclosed. An example multi-die package includes a computer processor unit (CPU) die, a memory die stacked in vertical alignment with the CPU die, and artificial intelligence (AI) architecture circuitry to infer a workload for at least one of the CPU die or the memory die. The AI architecture circuitry is to manage power consumption of at least one of the CPU die or the memory die based on the inferred workload.