- Patent Title: Touch sensor stack structure and method of manufacturing the same
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Application No.: US17195886Application Date: 2021-03-09
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Publication No.: US11320943B2Publication Date: 2022-05-03
- Inventor: Hyun Min Shin , Heon Kim
- Applicant: DONGWOO FINE-CHEM CO., LTD.
- Applicant Address: KR Jeollabuk-do
- Assignee: DONGWOO FINE-CHEM CO., LTD.
- Current Assignee: DONGWOO FINE-CHEM CO., LTD.
- Current Assignee Address: KR Jeollabuk-do
- Agency: The PL Law Group, PLLC
- Priority: KR10-2020-0031938 20200316
- Main IPC: G06F3/044
- IPC: G06F3/044 ; G06F3/041
Abstract:
A touch sensor stack structure according to an exemplary embodiment of the present invention includes a touch sensor structure including a bonding portion, a circuit connection structure bonded to the bonding portion of the touch sensor structure, and an optical film stacked on the touch sensor structure. The optical film includes a protrusion covering an end portion of the circuit connection structure and overlapping the bonding portion. Damages of electrodes included in the touch sensor structure can be prevented by the optical film.
Public/Granted literature
- US20210286466A1 TOUCH SENSOR STACK STRUCTURE AND METHOD OF MANUFACTURING THE SAME Public/Granted day:2021-09-16
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