Invention Grant
- Patent Title: Coil component and method of manufacturing the same
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Application No.: US16126554Application Date: 2018-09-10
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Publication No.: US11322291B2Publication Date: 2022-05-03
- Inventor: Seong Min Cho , Chang Hyun Shin , Sang Seob Kim
- Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Applicant Address: KR Suwon-Si
- Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Current Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Current Assignee Address: KR Suwon-Si
- Agency: Morgan, Lewis & Bockius LLP
- Priority: KR10-2018-0016442 20180209
- Main IPC: H01F17/04
- IPC: H01F17/04 ; H01F27/28 ; H01F17/00 ; H01F27/29 ; H01F41/04 ; H01F27/32

Abstract:
A coil component includes a magnetic body and a coil portion embedded in the magnetic body. The coil portion includes an internal insulating layer, coil patterns disposed on opposite surfaces of the internal insulating layer, an insulating wall disposed between turns of a coil pattern, an external insulating layer disposed on the insulating wall and the coil pattern, and a connection portion including a first conductive layer and a second conductive layer having a melting point lower than a melting point of the first conductive layer, and penetrating through the internal insulating layer to connect the coil patterns disposed on the opposite surfaces of the internal insulating layer to each other.
Public/Granted literature
- US20190252109A1 COIL COMPONENT AND METHOD OF MANUFACTURING THE SAME Public/Granted day:2019-08-15
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