- Patent Title: Silicon carbide substrate and silicon carbide epitaxial substrate
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Application No.: US16614016Application Date: 2018-04-03
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Publication No.: US11322349B2Publication Date: 2022-05-03
- Inventor: Tsubasa Honke , Kyoko Okita
- Applicant: SUMITOMO ELECTRIC INDUSTRIES, LTD.
- Applicant Address: JP Osaka
- Assignee: SUMITOMO ELECTRIC INDUSTRIES, LTD.
- Current Assignee: SUMITOMO ELECTRIC INDUSTRIES, LTD.
- Current Assignee Address: JP Osaka
- Agency: Faegre Drinker Biddle & Reath LLP
- Priority: JPJP2017-099853 20170519
- International Application: PCT/JP2018/014232 WO 20180403
- International Announcement: WO2018/211842 WO 20181122
- Main IPC: H01L21/02
- IPC: H01L21/02 ; C30B29/36 ; H01L21/304

Abstract:
A TTV of the silicon carbide substrate is less than or equal to 3 μm. The first main surface includes a first central region surrounded by a square having each side of 90 mm. An intersection of diagonal lines of the first central region coincides with a center of the first main surface. The first central region is constituted of nine square regions each having each side of 30 mm. A maximum LTV among the nine square regions is less than or equal to 1 μm. An arithmetic mean roughness Sa in a second central region is less than or equal to 0.1 nm, the second central region being surrounded by a square centering on the intersection and having each side of 250 μm.
Public/Granted literature
- US20200083039A1 SILICON CARBIDE SUBSTRATE AND SILICON CARBIDE EPITAXIAL SUBSTRATE Public/Granted day:2020-03-12
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