Invention Grant
- Patent Title: Wafer storage box, wafer transfer device and wafer storage and transfer assembly having the same
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Application No.: US17344515Application Date: 2021-06-10
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Publication No.: US11322379B2Publication Date: 2022-05-03
- Inventor: Shih Feng Pan
- Applicant: DLY TECHNOLOGIES INC.
- Applicant Address: TW Kaohsiung
- Assignee: DLY TECHNOLOGIES INC.
- Current Assignee: DLY TECHNOLOGIES INC.
- Current Assignee Address: TW Kaohsiung
- Agency: Muncy, Geissler, Olds & Lowe, P.C.
- Priority: TW109120229 20200616
- Main IPC: H01L21/677
- IPC: H01L21/677 ; H01L21/673 ; H01L21/683

Abstract:
A wafer storage box, wafer transfer device and wafer storage box and transfer assembly. The wafer storage and transfer assembly includes a chassis which is capable of translating or rotating, a sliding shaft, connecting levers, arms and at least two positioning sidewall. The chassis includes a groove. The sliding shaft can translate along the groove. The connecting levers are connected to the sliding shaft. Each arm extends from a connecting lever. The two positioning sidewall are respectively arranged on opposite sides of the chassis. Each positioning sidewall includes tracks accommodating the pins of connecting levers. The width of each of the tracks reduces from the front end of the positioning sidewall to the back end of the positioning sidewall. The wafer storage and transfer assembly can vacuum adsorb several wafers to achieve high efficiency of wafer storing and transferring.
Public/Granted literature
- US20210391191A1 WAFER STORAGE BOX, WAFER TRANSFER DEVICE AND WAFER STORAGE AND TRANSFER ASSEMBLY HAVING THE SAME Public/Granted day:2021-12-16
Information query
IPC分类: