Invention Grant
- Patent Title: Adhesive tape for semiconductor processing, and semiconductor device manufacturing method
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Application No.: US17083462Application Date: 2020-10-29
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Publication No.: US11322385B2Publication Date: 2022-05-03
- Inventor: Kazuto Aizawa , Jun Maeda
- Applicant: LINTEC Corporation
- Applicant Address: JP Tokyo
- Assignee: LINTEC Corporation
- Current Assignee: LINTEC Corporation
- Current Assignee Address: JP Tokyo
- Agency: Cahn & Samuels, LLP
- Priority: JP2016-195996 20161003
- Main IPC: H01L21/683
- IPC: H01L21/683 ; C09J201/00 ; H01L21/304 ; H01L21/78 ; C09J7/38
Abstract:
A pressure sensitive adhesive tape for semiconductor processing includes a base having a Young's modulus of 1000 MPa or more at 23° C., and a pressure sensitive adhesive layer provided on at least one surface of the base, and the product (N)×(C) of (N) and (C) is 500 or more at 30° C., and 9000 or less at 60° C., where (N) [μm] is a thickness of the pressure sensitive adhesive layer and (C) [μm] is a creep amount.
Public/Granted literature
- US20210043492A1 Adhesive Tape for Semiconductor Processing, and Semiconductor Device Manufacturing Method Public/Granted day:2021-02-11
Information query
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