Invention Grant
- Patent Title: Wafer processing method
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Application No.: US16916408Application Date: 2020-06-30
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Publication No.: US11322406B2Publication Date: 2022-05-03
- Inventor: Shigenori Harada , Minoru Matsuzawa , Hayato Kiuchi , Yoshiaki Yodo , Taro Arakawa , Masamitsu Agari , Emiko Kawamura , Yusuke Fujii , Toshiki Miyai , Makiko Ohmae
- Applicant: DISCO CORPORATION
- Applicant Address: JP Tokyo
- Assignee: DISCO CORPORATION
- Current Assignee: DISCO CORPORATION
- Current Assignee Address: JP Tokyo
- Agency: Greer Burns & Crain, Ltd.
- Priority: JPJP2019-128463 20190710
- Main IPC: H01L21/78
- IPC: H01L21/78 ; H01L21/683 ; H01L21/268 ; B23K26/364 ; H01L21/68 ; H01L23/544
Abstract:
A wafer processing method includes a polyester sheet providing step of positioning a wafer in an inside opening of a ring frame and providing a polyester sheet on a back side or a front side of the wafer and on a back side of the ring frame, a uniting step of heating the polyester sheet as applying a pressure to the polyester sheet to thereby unite the wafer and the ring frame through the polyester sheet by thermocompression bonding, a dividing step of applying a laser beam to the wafer to form modified layers in the wafer, thereby dividing the wafer into individual device chips, and a pickup step of applying an ultrasonic wave to the polyester sheet in each of the plurality of separate regions corresponding to each device chip, pushing up each device chip through the polyester sheet, then picking up each device chip from the polyester sheet.
Public/Granted literature
- US20210013100A1 WAFER PROCESSING METHOD Public/Granted day:2021-01-14
Information query
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