A substrate treatment method is provided, including: holding a substrate on a substrate holding unit; rotating the substrate holding unit to rotate the substrate; raising a cup member surrounding an outer periphery of the substrate holding unit to locate an upper end of the cup member in an upper end position higher than an upper surface of the substrate held on the substrate holding unit; discharging a treatment liquid from a discharge port of a nozzle located lower than the upper end position to an end portion of the upper surface of the substrate held on the substrate holding unit; an imaging process, acquiring captured images of an imaging region by a camera, wherein the imaging region contains the treatment liquid discharged from the discharge port and is seen from an imaging position above the substrate; and determining a discharge state of the treatment liquid based on the captured images.