Invention Grant
- Patent Title: Circuit module
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Application No.: US16744312Application Date: 2020-01-16
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Publication No.: US11322429B2Publication Date: 2022-05-03
- Inventor: Yoshiro Maeda
- Applicant: Murata Manufacturing Co., Ltd.
- Applicant Address: JP Kyoto-fu
- Assignee: Murata Manufacturing Co., Ltd.
- Current Assignee: Murata Manufacturing Co., Ltd.
- Current Assignee Address: JP Kyoto-fu
- Agency: Studebaker & Brackett PC
- Priority: JPJP2017-141313 20170720
- Main IPC: H05K1/00
- IPC: H05K1/00 ; H01L23/485 ; H01L23/12 ; H01L23/50 ; H01L23/528 ; H05K1/02 ; H05K1/18 ; H05K7/02

Abstract:
A circuit module includes a circuit board including an insulating layer, first and second signal conductors, a ground conductor, and a ground conductor layer; and an electronic component including first and second signal terminals and a first ground terminal. The ground conductor includes a first strip portion parallel to the first and second signal conductors. When a portion of the first signal conductor parallel to the second signal conductor and the first signal terminal are set as a first signal wiring line and a portion of the second signal conductor parallel to the first signal conductor and the second signal terminal are set as a second signal wiring line, the circuit board includes a first strip portion connection via conductor that connects the first strip portion and the ground conductor layer in a region where the first and second signal wiring lines are parallel to each other.
Public/Granted literature
- US20200152552A1 CIRCUIT MODULE Public/Granted day:2020-05-14
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