A package substrate according to an aspect of the disclosure includes a substrate body, and a first power trace pattern and a first ground trace pattern disposed on a first surface of the substrate body. The first power trace pattern has a parent power line portion and at least one child power line portion branched from the parent power line portion, and the first ground trace pattern has a parent ground line portion and at least one child ground line portion branched from the parent ground line portion. At least a portion of the first power trace pattern is disposed to surround at least a portion of the first ground trace pattern, and at least a portion of the first ground trace pattern is disposed to surround at least a portion of the first power trace pattern.