Invention Grant
- Patent Title: Package with integrated multi-tap impedance structure
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Application No.: US16992874Application Date: 2020-08-13
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Publication No.: US11322461B2Publication Date: 2022-05-03
- Inventor: Eduardo Schittler Neves , Dan Horia Popescu
- Applicant: Infineon Technologies AG
- Applicant Address: DE Neubiberg
- Assignee: Infineon Technologies AG
- Current Assignee: Infineon Technologies AG
- Current Assignee Address: DE Neubiberg
- Agency: Dicke, Billig & Czaja, PLLC
- Priority: DE102019121894.2 20190814
- Main IPC: H01L23/64
- IPC: H01L23/64 ; H01L23/495 ; H01L21/56 ; H01L23/00 ; H01L23/31
Abstract:
A package is disclosed. In one example the package comprises a carrier having a plurality of leads and an electronic component mounted on the carrier and comprising at least one pad. An impedance structure electrically couples the at least one pad with the carrier so that, at different ones of the leads, different impedance values of the impedance structure can be tapped.
Public/Granted literature
- US20210050311A1 PACKAGE WITH INTEGRATED MULTI-TAP IMPEDANCE STRUCTURE Public/Granted day:2021-02-18
Information query
IPC分类:
