Invention Grant
- Patent Title: Ferroelectric random access memory devices and methods
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Application No.: US16916363Application Date: 2020-06-30
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Publication No.: US11322505B2Publication Date: 2022-05-03
- Inventor: Bo-Feng Young , Sai-Hooi Yeong , Chi On Chui
- Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.
- Applicant Address: TW Hsinchu
- Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
- Current Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
- Current Assignee Address: TW Hsinchu
- Agency: Slater Matsil, LLP
- Main IPC: H01L27/15
- IPC: H01L27/15 ; H01L27/11514 ; H01L29/66 ; H01L29/06 ; H01L27/092

Abstract:
A method of forming a semiconductor device includes: forming a first fin protruding above a substrate; forming first source/drain regions over the first fin; forming a first plurality of nanostructures over the first fin between the first source/drain regions; forming a first gate structure around the first plurality of nanostructures; and forming a first ferroelectric capacitor over and electrically coupled to the first gate structure.
Public/Granted literature
- US20210408022A1 FERROELECTRIC RANDOM ACCESS MEMORY DEVICES AND METHODS Public/Granted day:2021-12-30
Information query
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