Invention Grant
- Patent Title: Semiconductor device and method for manufacturing the same
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Application No.: US16290849Application Date: 2019-03-01
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Publication No.: US11322512B2Publication Date: 2022-05-03
- Inventor: Shuto Yamasaka
- Applicant: Kioxia Corporation
- Applicant Address: JP Tokyo
- Assignee: Kioxia Corporation
- Current Assignee: Kioxia Corporation
- Current Assignee Address: JP Tokyo
- Agency: Foley & Lardner LLP
- Priority: JPJP2018-102570 20180529
- Main IPC: H01L27/11582
- IPC: H01L27/11582 ; H01L21/28

Abstract:
A semiconductor device including a stacked body that includes insulating layers and conductive layers that are alternately stacked, a first film provided inside a recess portion that penetrates through the stacked body, a second film provided on a surface of the first film, a third film provided on a surface of the second film, and a fourth film provided on a surface of the third film. An average concentration of a halogen element per unit area in the third film and the fourth film is lower than an average concentration of the halogen element per unit area at an interface between the third film and the fourth film.
Information query
IPC分类: