Invention Grant
- Patent Title: Array substrate and manufacturing method thereof
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Application No.: US16608097Application Date: 2019-05-20
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Publication No.: US11322521B2Publication Date: 2022-05-03
- Inventor: Xiaohui Nie
- Applicant: WUHAN CHINA STAR OPTOELECTRONICS TECHNOLOGY CO., LTD.
- Applicant Address: CN Hubei
- Assignee: WUHAN CHINA STAR OPTOELECTRONICS TECHNOLOGY CO., LTD.
- Current Assignee: WUHAN CHINA STAR OPTOELECTRONICS TECHNOLOGY CO., LTD.
- Current Assignee Address: CN Hubei
- Priority: CN201910327910.3 20190423
- International Application: PCT/CN2019/087552 WO 20190520
- International Announcement: WO2020/215414 WO 20201029
- Main IPC: H01L27/14
- IPC: H01L27/14 ; H01L27/12

Abstract:
Disclosed is an array substrate, including a substrate, and a first data line, a first insulating layer and a second data line, which are disposed on the substrate in sequence. The first insulating layer is provided with a first via hole. The second data line is connected to the first data line through the first via hole. By configuring double-layer data lines, an area of the data lines is increased, thereby reducing the impedance of the data lines, thereby improving the charging capability of the remote pixels and the display quality of the panel.
Public/Granted literature
- US20210335822A1 ARRAY SUBSTRATE AND MANUFACTURING METHOD THEREOF Public/Granted day:2021-10-28
Information query
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