Invention Grant
- Patent Title: Array substrate
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Application No.: US16624792Application Date: 2019-10-21
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Publication No.: US11322522B2Publication Date: 2022-05-03
- Inventor: Weiwei Yang
- Applicant: Wuhan China Star Optoelectronics Semiconductor Display Technology Co., Ltd.
- Applicant Address: CN Hubei
- Assignee: Wuhan China Star Optoelectronics Semiconductor Display Technology Co., Ltd.
- Current Assignee: Wuhan China Star Optoelectronics Semiconductor Display Technology Co., Ltd.
- Current Assignee Address: CN Hubei
- Agency: Berger Singerman, LLP
- Agent Geoffrey Lottenberg
- Priority: CN201910660434.7 20190722
- International Application: PCT/CN2019/112089 WO 20191021
- International Announcement: WO2021/012429 WO 20210128
- Main IPC: H01L27/12
- IPC: H01L27/12

Abstract:
An array substrate provided. Since arranging a second metal layer into a grid structure, the grid structure and a constant voltage signal trace disposed on a third metal layer are connected in parallel, and a storage capacitor is used as a connection point for the grid structure. The grid structure ensures a high pixel density and also reduces voltage drop, thereby improving brightness uniformity. Moreover, in the manufacturing process, the grid structure and the second metal layer can be formed simultaneously, thereby eliminating a need for additional processes and saving cost.
Public/Granted literature
- US20210366934A1 ARRAY SUBSTRATE Public/Granted day:2021-11-25
Information query
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