Invention Grant
- Patent Title: Semiconductor device
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Application No.: US17007240Application Date: 2020-08-31
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Publication No.: US11322585B2Publication Date: 2022-05-03
- Inventor: Shoko Hanagata
- Applicant: KABUSHIKI KAISHA TOSHIBA , TOSHIBA ELECTRONIC DEVICES & STORAGE CORPORATION
- Applicant Address: JP Tokyo; JP Tokyo
- Assignee: KABUSHIKI KAISHA TOSHIBA,TOSHIBA ELECTRONIC DEVICES & STORAGE CORPORATION
- Current Assignee: KABUSHIKI KAISHA TOSHIBA,TOSHIBA ELECTRONIC DEVICES & STORAGE CORPORATION
- Current Assignee Address: JP Tokyo; JP Tokyo
- Agency: Kim & Stewart LLP
- Priority: JPJP2020-041043 20200310
- Main IPC: H01L29/06
- IPC: H01L29/06 ; H01L29/739 ; H01L29/861

Abstract:
A semiconductor device includes a semiconductor layer. The semiconductor layer has bottom and upper surfaces opposite to each other in a first direction. The semiconductor layer includes a first region of a first conductivity type at the bottom surface, a second region of the first conductivity type at the bottom surface surrounding the first region, a third region of the first conductivity type above the first and second regions, and a fourth region of a second conductivity type extending from the upper surface into the third region. In a first cross sectional plane along the first direction, an outer edge of the first region is within an outer edge of the fourth region by a first distance. In a second cross sectional plane along the first direction, an outer edge of the first region is within an outer edge of the fourth region by a second distance.
Public/Granted literature
- US20210288142A1 SEMICONDUCTOR DEVICE Public/Granted day:2021-09-16
Information query
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