Invention Grant
- Patent Title: Semiconductor device and method for fabricating the same
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Application No.: US16907287Application Date: 2020-06-21
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Publication No.: US11322598B2Publication Date: 2022-05-03
- Inventor: YI-Fan Li , Wen-Yen Huang , Shih-Min Chou , Zhen Wu , Nien-Ting Ho , Chih-Chiang Wu , Ti-Bin Chen
- Applicant: UNITED MICROELECTRONICS CORP.
- Applicant Address: TW Hsin-Chu
- Assignee: UNITED MICROELECTRONICS CORP.
- Current Assignee: UNITED MICROELECTRONICS CORP.
- Current Assignee Address: TW Hsin-Chu
- Agent Winston Hsu
- Priority: TW107134933 20181003
- Main IPC: H01L29/49
- IPC: H01L29/49 ; H01L29/40 ; H01L27/092

Abstract:
A semiconductor device includes a substrate having a first region and a second region and a gate structure on the first region and the second region of the substrate. The gate structure includes a first bottom barrier metal (BBM) layer on the first region and the second region, a first work function metal (WFM) layer on the first region; and a diffusion barrier layer on a top surface and a sidewall of the first WFM layer on the first region and the first BBM layer on the second region. Preferably, a thickness of the first BBM layer on the second region is less than a thickness of the first BBM layer on the first region.
Public/Granted literature
- US20200321442A1 SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE SAME Public/Granted day:2020-10-08
Information query
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