Invention Grant
- Patent Title: Light-emitting diode package and electronic device
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Application No.: US16726285Application Date: 2019-12-24
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Publication No.: US11322646B2Publication Date: 2022-05-03
- Inventor: Shun-Yuan Hu , Chin-Lung Ting , Ker-Yih Kao , Li-Wei Mao
- Applicant: InnoLux Corporation
- Applicant Address: TW Miao-Li County
- Assignee: InnoLux Corporation
- Current Assignee: InnoLux Corporation
- Current Assignee Address: TW Miao-Li County
- Agency: McClure, Qualey & Rodack, LLP
- Priority: CN201910843568.2 20190906
- Main IPC: H01L33/06
- IPC: H01L33/06 ; H01L33/44 ; H01L33/62

Abstract:
Some embodiments of the present disclosure provide a light-emitting diode package. The light-emitting diode package includes a transparent substrate. The light-emitting diode package also includes a first light-emitting diode which is disposed on the transparent substrate and has a first multiple quantum well structure. The light-emitting diode package further includes a second light-emitting diode which is disposed on the transparent substrate and has a second multiple quantum well structure. The first multiple quantum well structure and the second multiple quantum well structure are disposed to emit lights with different wavelengths.
Public/Granted literature
- US20200235261A1 LIGHT-EMITTING DIODE PACKAGE AND ELECTRONIC DEVICE Public/Granted day:2020-07-23
Information query
IPC分类: