Invention Grant
- Patent Title: Buried contact layer for UV emitting device
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Application No.: US16864838Application Date: 2020-05-01
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Publication No.: US11322647B2Publication Date: 2022-05-03
- Inventor: Johnny Cai Tang , Chun To Lee , Guilherme Tosi , Christopher Flynn , Liam Anderson , Timothy William Bray , Petar Atanackovic
- Applicant: Silanna UV Technologies Pte Ltd
- Applicant Address: SG Singapore
- Assignee: Silanna UV Technologies Pte Ltd
- Current Assignee: Silanna UV Technologies Pte Ltd
- Current Assignee Address: SG Singapore
- Agency: MLO, a professional corp.
- Main IPC: H01L33/06
- IPC: H01L33/06 ; H01L33/38 ; H01L33/00 ; H01L33/32 ; H01L33/14 ; H01L33/12

Abstract:
In some embodiments, a light emitting structure comprises a layered semiconductor stack comprising a first set of doped layers, a second layer, a light emitting layer positioned between the first set of doped layers and the second layer, and an electrical contact to the first set of doped layers. The first set of doped layers can comprise a first sub-layer, a second sub-layer, and a third sub-layer, where the third sub-layer is adjacent to the light emitting layer. The electrical contact to the first set of doped layers can be made to the second sub-layer. The first, second and third sub-layers can be doped n-type, and an electrical conductivity of the second sub-layer can be higher than an electrical conductivity of the first and third sub-layers. In some cases, the second sub-layer can absorb more light emitted from the light emitting layer than the first or third sub-layers.
Public/Granted literature
- US20210343896A1 BURIED CONTACT LAYER FOR UV EMITTING DEVICE Public/Granted day:2021-11-04
Information query
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