Invention Grant
- Patent Title: Light-emitting diode, method for manufacturing the same, backlight source and display device for improving heat dissipation
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Application No.: US16609888Application Date: 2019-04-29
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Publication No.: US11322671B2Publication Date: 2022-05-03
- Inventor: Tao Wang
- Applicant: BOE OPTICAL SCIENCE AND TECHNOLOGY CO., LTD. , BOE TECHNOLOGY GROUP CO., LTD.
- Applicant Address: CN Jiangsu; CN Beijing
- Assignee: BOE OPTICAL SCIENCE AND TECHNOLOGY CO., LTD.,BOE TECHNOLOGY GROUP CO., LTD.
- Current Assignee: BOE OPTICAL SCIENCE AND TECHNOLOGY CO., LTD.,BOE TECHNOLOGY GROUP CO., LTD.
- Current Assignee Address: CN Jiangsu; CN Beijing
- Agency: Nath, Goldberg & Meyer
- Agent Joshua B. Goldberg
- Priority: CN201820692261.8 20180510
- International Application: PCT/CN2019/085048 WO 20190429
- International Announcement: WO2019/214490 WO 20191114
- Main IPC: H01L33/64
- IPC: H01L33/64 ; H01L23/00 ; H01L33/62

Abstract:
The present disclosure provides a light-emitting diode, a method for manufacturing the same, a backlight source and a display device. The light-emitting diode includes a support having a bottom wall, a light-emitting chip on the support, and a die bonding structure. A through hole is provided in the bottom wall. At least a portion of the die bonding structure is located in the through hole. The light-emitting chip is attached to the bottom wall through the die bonding structure.
Public/Granted literature
- US20210336115A1 Light-Emitting Diode, Method for Manufacturing the Same, Backlight Source and Display Device Public/Granted day:2021-10-28
Information query
IPC分类: