Invention Grant
- Patent Title: Electrical connector assembly having floating heat sink in resilient manner
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Application No.: US17019386Application Date: 2020-09-14
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Publication No.: US11322871B2Publication Date: 2022-05-03
- Inventor: Chun-Chieh Yang , Wei-Chih Lin , Hsiu-Yuan Hsu
- Applicant: FOXCONN (KUNSHAN) COMPUTER CONNECTOR CO., LTD. , FOXCONN INTERCONNECT TECHNOLOGY LIMITED
- Applicant Address: CN Kunshan; KY Grand Cayman
- Assignee: FOXCONN (KUNSHAN) COMPUTER CONNECTOR CO., LTD.,FOXCONN INTERCONNECT TECHNOLOGY LIMITED
- Current Assignee: FOXCONN (KUNSHAN) COMPUTER CONNECTOR CO., LTD.,FOXCONN INTERCONNECT TECHNOLOGY LIMITED
- Current Assignee Address: CN Kunshan; KY Grand Cayman
- Agent Ming Chieh Chang; Wei Te Chung
- Priority: CN201910863840.3 20190912
- Main IPC: H01R12/71
- IPC: H01R12/71 ; H05K7/20 ; H01R13/629 ; H01R13/62 ; H01L23/40 ; H01L23/367 ; G06F1/20 ; H01R12/70 ; H05K1/02 ; H01R13/533 ; H01R13/502

Abstract:
An electrical connector assembly includes a seat unit and a cover unit. The seat unit defines a receiving cavity for receiving the CPU. The cover unit is pivotably mounted upon one end of the seat unit. The cover unit includes a first cover and a second cover surrounding the first cover. The first cover includes a first frame equipped with therein a floating heat sink which is located above and aligned with the receiving cavity. The heat sink forms a pair of side extensions sandwiched between a pair of pressing blocks and the first frame in a vertical direction and essentially downwardly pressed by the pair of pressing blocks of the first cover in a resilient manner. Resilient mechanism is provided between the pressing block and the heat sink to result in a downward force constantly urge the heat sink downwardly against the first frame.
Public/Granted literature
- US20210083411A1 ELECTRICAL CONNECTOR ASSEMBLY HAVING FLOATING HEAT SINK IN RESILIENT MANNER Public/Granted day:2021-03-18
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