Invention Grant
- Patent Title: Light emitting element housing package, light emitting device, and light emitting module
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Application No.: US16275964Application Date: 2019-02-14
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Publication No.: US11322907B2Publication Date: 2022-05-03
- Inventor: Daisuke Ueyama , Chiaki Doumoto , Takeshi Kamikawa
- Applicant: KYOCERA Corporation
- Applicant Address: JP Kyoto
- Assignee: KYOCERA Corporation
- Current Assignee: KYOCERA Corporation
- Current Assignee Address: JP Kyoto
- Agency: Volpe Koenig
- Priority: JPJP2018-025896 20180216,JPJP2018-026013 20180216
- Main IPC: H01S5/0233
- IPC: H01S5/0233 ; H01S5/023 ; H01L23/00 ; H01S5/0235 ; H01S5/02345 ; H01S5/024 ; H01S5/02216

Abstract:
A light emitting element housing package of the present disclosure includes a base part including a first surface including a first recessed part for mounting a light emitting element. Surface roughness Sa of at least such a region of a bottom surface of the first recessed part that is opposite to a light emitting element mounted on the first recessed part is smaller than surface roughness Sa of a region other than the first recessed part of the first surface. Further, a light emitting device of the present disclosure includes the light emitting element housing package and a light emitting element housed in the light emitting element housing package. Further, a light emitting module of the present disclosure includes the light emitting device and a module substrate on which the light emitting device is mounted.
Public/Granted literature
- US20190260179A1 LIGHT EMITTING ELEMENT HOUSING PACKAGE, LIGHT EMITTING DEVICE, AND LIGHT EMITTING MODULE Public/Granted day:2019-08-22
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